Seoul, KOREA ¶ Feb 28, 2012 (Whowired) -- Hynix Semiconductor unveiled its mobile communications-related products in Mobile World Congress 2012 held in Barcelona, Spain, from February 27. It was the first time that the company participated in the event. The Korean memory-chip maker showed its strong resolve to find opportunities in the global communications market by coming to the event jointly with SK Telecom.
With the slogan “Hynix Enabling a Ubiquitous World,” it presented a variety of mobile solutions, which included 20nm-class 4 gigabyte DDR3 and 30nm 3 gigabyte LPDDR3 DRAMs. The company also made public a vehicle infotainment memory chip developed jointly with NVIDIA.
Kim Ji-Beom, senior executive with Hynix in charge of marketing, said, “Hynix is capable of supplying a multitude of products equipped with all three properties, namely high capacity, high performance, and low power consumption. We are fully ready to provide competitive solutions to rapidly growing mobile applications market.”
The company expects that the participation in the Mobile World Congress event would give it an important momentum to plunge into the smart mobile solutions market by expanding the customer base in the area. Hynix this year will put more than a half of its US$3.7 billion investment in NAND flash memory while diversifying DRAM product portfolios with mobile-friendly properties of high capacity, high performance, and low power consumption.
As the company became part of SK Telecom with the latter’s 21-percent investment ($3.04 billion) in Hynix in November 2011, it will increase its presence in the mobile market to take advantage of group affiliation.
Sean Chung (firstname.lastname@example.org)
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